Cu Recrystallization and the Formation of Epitaxial and Non-Epitaxial Cu/Cu/Cu Interfaces in Stacked Blind Micro Via Structures-Reference-Cited by-同舟云学术

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Cu Recrystallization and the Formation of Epitaxial and Non-Epitaxial Cu/Cu/Cu Interfaces in Stacked Blind Micro Via Structures

Published:2021-06 Issue: Volume: Page:
ISSN:
Container-title:2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
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Author:

Bernhard T.,Dieter S.,Massey R.,Kempa S.,Steinhauser E.,Bruning F.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9501397/9501403/09501545.pdf?arnumber=9501545

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Investigation of Blind MicroVias Bonding Force: A Field Study;2024 International Conference on Electronics Packaging (ICEP);2024-04-17

2. A Predictive Metallographic Means to Identify The Relative Risk of Failure for Plated Micro Vias;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

3. Facet type determination based on combined atomic force microscopy and electron backscatter diffraction;Journal of Microscopy;2023-01-30

4. Hydrogen Embrittlement Suppressors for Nickel-Free Electroless Copper Baths;2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2022-10-26

5. Plating and Recrystallization of Galvanic Cu Films on Roll Annealed and Polycrystalline Cu Foils and the Effect of Intermediate Electroless Cu Layers;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

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