Funder
National Science Foundation of China
Chongqing Application Foundation and Research in Cutting-Edge Technologies
Open Research Fund Program of Shenzhen Key Laboratory of Spatial Smart Sensing and Services, Shenzhen University
ICT Research and Development Program of MSIP/IITP, Resilient Cyber-Physical Systems Research
GRL Program through NRF
DGIST Research and Development Program, CPS Global Center, through MSIP
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Computer Science Applications,Mechanical Engineering,Automotive Engineering
Cited by
44 articles.
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