Easy Process and Performance Improvement for Top-Emission Organic Light-Emitting Diodes by Using UV Glue as the Insulation Layer on Copper Substrate-Reference-Cited by-同舟云学术

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Easy Process and Performance Improvement for Top-Emission Organic Light-Emitting Diodes by Using UV Glue as the Insulation Layer on Copper Substrate

Published:2010-07 Issue:7 Volume:6 Page:279-283
ISSN:1551-319X
Container-title:Journal of Display Technology
language:
Short-container-title:J. Display Technol.

Author:

Tsai Yu-Sheng,Wang Shun-Hsi,Juang Fuh-Shyang,Chang Shu-Wei,Chen Chuan-hung,Chung Ming-Hua,Hsieh Tsung-Eong,Liu Mark-O.,Liao Teh-Chao

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx5/9425/5466491/05485048.pdf?arnumber=5485048

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. In-Depth Analysis of Structures, Materials, Models, Parameters, and Applications of Organic Light-Emitting Diodes;Journal of Electronic Materials;2020-05-21

2. High precision assembly and efficient dispensing approaches for millimeter objects;International Journal of Advanced Robotic Systems;2019-05-01

3. Simulation of Multilayer Energy Efficient OLEDs for Flexible Electronics Applications;Procedia Computer Science;2019

4. Flexible ZnO Thin-Film Transistors on Thin Copper Substrate;IEEE Transactions on Electron Devices;2018-09

5. Flexible organic electronic devices on metal foil substrates for lighting, photovoltaic, and other applications;Handbook of Flexible Organic Electronics;2015

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