1. Hardware Architecture of the Universal High-Speed Interconnection Chiplet for Chiplet Integration;2024 9th International Conference on Computer and Communication Systems (ICCCS);2024-04-19
2. Multi-Chiplet Implementation of a Replaceable Integrated Chiplet (PINCH) Assembly;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-03
3. Chiplets for Integration of Electronic Systems;IETE Journal of Education;2024-02-15
4. Chiplet Communications (Bridges);Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology;2024
5. An Improved Test Structure of Boundary Scan Designed for 2.5D Integration;2023 8th International Conference on Integrated Circuits and Microsystems (ICICM);2023-10-20