Detection of Sub-Design Rule Physical Defects Using E-Beam Inspection-Reference-Cited by-同舟云学术

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Detection of Sub-Design Rule Physical Defects Using E-Beam Inspection

Published:2013-11 Issue:4 Volume:26 Page:476-481
ISSN:0894-6507
Container-title:IEEE Transactions on Semiconductor Manufacturing
language:
Short-container-title:IEEE Trans. Semicond. Manufact.

Author:

Patterson Oliver D.,Lee Julie,Salvador Dave M.,Lei Shuen-Cheng Chris,Tang Xiaohu

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/66/6648707/06607233.pdf?arnumber=6607233

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Addressing misclassification costs in machine learning through asymmetric loss functions;Metrology, Inspection, and Process Control XXXVII;2023-04-27

2. Spot-scanning laser scattering system for defects detection of wafer surface;Thirteenth International Conference on Information Optics and Photonics (CIOP 2022);2022-12-15

3. Aperture design for a dark-field wafer defect inspection system;Applied Optics;2021-12-03

4. Applying Data Augmentation and Mask R-CNN-Based Instance Segmentation Method for Mixed-Type Wafer Maps Defect Patterns Classification;IEEE Transactions on Semiconductor Manufacturing;2021-11

5. Creative Use of Vector Scan for Efficient SRAM Inspection;2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC);2020-08

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