Investigating the Sintering Process and Mechanical Properties of Nano-copper Particles Coupling Particle Packing Modeling with Molecular Dynamics Simulation-Reference-Cited by-同舟云学术

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Investigating the Sintering Process and Mechanical Properties of Nano-copper Particles Coupling Particle Packing Modeling with Molecular Dynamics Simulation

Published:2024-04-07 Issue: Volume: Page:1-7
ISSN:
Container-title:2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
language:
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Author:

Liu Xu¹,Hu Dong²,Li Zichuan²,Fan Xuejun³,Zhang Guoqi²,Fan Jiajie¹

Affiliation:

1. Fudan University,Academy for Engineering & Technology; Shanghai Engineering Technology Research Center for SiC Power Device,Shanghai,China,200433

2. Delft University of Technology,EEMCS Faculty,Delft,the Netherlands

3. Lamar University,Department of Mechanical Engineering,Beaumont,TX,USA,77710

Funder

National Natural Science Foundation of China

Technology Development

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491281/10491408/10491446.pdf?arnumber=10491446

Reference23 articles.

1. Thermal management and packaging of wide and ultra-wide bandgap power devices: a review and perspective

2. Size-dependent melting properties of tin nanoparticles

3. Brief review of silver sinter-bonding processing for packaging high-temperature power devices

4. Enhanced thermal conductivity for Ag-deposited alumina sphere/epoxy resin composites through manipulating interfacial thermal resistance

5. Preparation of solid silver nanoparticles for inkjet printed flexible electronics with high conductivity

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