Failure Strength Analysis and Young Modulus Assessment of 4H-SiC through a Ball on Ring Test-Reference-Cited by-同舟云学术

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Failure Strength Analysis and Young Modulus Assessment of 4H-SiC through a Ball on Ring Test

Published:2022-04-25 Issue: Volume: Page:
ISSN:
Container-title:2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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Author:

Vinciguerra Vincenzo¹,Landi Antonio¹,Hintermaier Herbert²,Badala Paolo³,Klug Gerald⁴,Sitta Alessandro¹,Calabretta Michele¹,Bassi Anna³,Renna Marco¹,Messina Angelo Alberto⁵

Affiliation:

1. STMicroelectronics,ADG R&D,Catania,Italy,95121

2. DISCO Hi-Tec Europe GmbH,Kirchheim Muenchen,Germany,D-85551

3. STMicroelectronics,Analog & Power Front End Manufacturing,Catania,Italy,95121

4. DISCO H-Tec Europe GmbH,Kirchheim Muenchen,Germany,D-85551

5. Italy Pubblic Affairs STMicroelectonics,Catania,Italy,95121

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9758836/9758837/09758855.pdf?arnumber=9758855

Reference16 articles.

1. Evaluation by three-point-bend and ball-on-ring tests of thinning process on silicon die strength

2. Ball?on?Ring Test Revisited;de with e h h wagemans;Journal of the American Ceramic Society,1989

3. Uniaxial/biaxial flexure strengths and elastic properties of resin-composite block materials for CAD/CAM

4. Standard Test Method for Monotonic Equibiaxial Flexural Strength of Advanced Ceramics at Ambient Temperature;ASTM Standards,2009

5. A Method for Determining the Strength of Sheet Glass;vitman;Translated from Zavodskaya Laboratoriya,1963

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