Numerical Simulation of a Wire Bond Shear Test Using Nonlinear Adaptive Remeshing
Author:
Affiliation:
1. Technical University Berlin,Berlin,10587
2. Fraunhofer IZM,Berlin,10587
Funder
Deutsche Forschungsgemeinschaft
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9758836/9758837/09758846.pdf?arnumber=9758846
Reference9 articles.
1. Cyclic robustness of heavy wire bonds: Al, AlMg, Cu and CucorAl
2. Alternative Drahtwerkstoffe für den Einsatz im Wedge/Wedge-Bondprozess;geissler;Fellbach,2012
3. Influence of wire material and diameter on the reliability of Al-H11, Al-CR, Al-R and AlX heavy wire bonds during power cycling;ehrhardt;International Conference in Integrated Power Electronics Systems CIPS,2016
4. European R&D Trends in wire bonding technologies
5. On cropping and related processes
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1. Determination of Lemaitre Damage Parameters for Al H11 Wire Material;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17
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