Using Grid Search Methods and Parallel Computing to Reduce AI Training Time for Reliability Lifetime Prediction of Wafer-Level Packaging
Author:
Affiliation:
1. National Tsing Hua University,Advanced Microsystem Packaging and Nano-Mechanics Research Lab,Dept. of Power Mechanical Engineering,Hsinchu,Taiwan, R.O.C,300
Funder
National Science and Technology Council
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10100701/10100725/10100751.pdf?arnumber=10100751
Reference11 articles.
1. Parallel SMO algorithm implementation based on OpenMP;chang;2014 IEEE International Conference on System Science and Engineering (ICSSE) ICSSE,0
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3. Reliability assessment using modified energy based model for WLCSP solder joints
4. An Overview of AI-Assisted Design-on-Simulation Technology for Reliability Life Prediction of Advanced Packaging
5. Predicting Wafer-Level Package Reliability Life Using Mixed Supervised and Unsupervised Machine Learning Algorithms
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