An Advanced Finite Element Model of the Cu Pillar Solder Reflow Assembly-Reference-Cited by-同舟云学术

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An Advanced Finite Element Model of the Cu Pillar Solder Reflow Assembly

Published:2023-04-17 Issue: Volume: Page:
ISSN:
Container-title:2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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Author:

Zhibo Cao¹,Baran Pekkolay²,Aslihan Okur²,Bruno Heusdens³,Corrado Carta¹,Mehmet Kaynak¹

Affiliation:

1. IHP – Leibniz-Institut für innovative Mikroelektronik,Germany

2. Sabancı University,Turkey

3. TAIPRO Engineering,Belgium

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10100701/10100725/10100808.pdf?arnumber=10100808

Reference8 articles.

1. Fine-Pitch (≤10 µm) Direct Cu-Cu Interconnects Using In-Situ Formic Acid Vapor Treatment

2. Overview of leadfree solders;sigelko;Adv Mater Process,2000

3. Characteristics and reliability of fast-flow, snap-cure, and reworkable underfills for solder bumped flip chip on low-cost substrates

4. Size effects in small scaled lead-free solder joints

5. An assembly process oriented thermal-mechanical characterization of a fan-out wafer-level package

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