FEM-study for Solder Model Comparison on Solder Joints Stress-Strain Effects
Author:
Affiliation:
1. Fraunhofer Institute for Ceramic Technologies and Systems IKTS,Dresden,Germany
2. Dresden University of Technology,Electronics Packaging Laboratory,Germany
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9146595/9152196/09152683.pdf?arnumber=9152683
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Temperature-dependent Creep Characterization of Lead-free Solder Alloys Using Nanoindentation for Finite Element Modeling;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05
2. FEM Modelling of Ag-Sinter Joints with Respect of Porosity and Sinter Pressure;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17
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