Influence of Ball Size and Geometry on the Reliability and RF Performance of mmWave System-in-Package: A Simulation Approach-Reference-Cited by-同舟云学术

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Influence of Ball Size and Geometry on the Reliability and RF Performance of mmWave System-in-Package: A Simulation Approach

Published:2021-04-19 Issue: Volume: Page:
ISSN:
Container-title:2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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Author:

Dilek Seyyid,Ndip Ivan,Rossi Marco,Tschoban Christian,Kuttler Simon,Wittler Olaf,Lang Klaus-Dieter,Goetze Christian,Berger Daniel,Wieland Marcel,Schneider-Ramelow Martin

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9410808/9410806/09410849.pdf?arnumber=9410849

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Analysis of the influences of PCB process tolerances and assembly tolerances on 60 GHz radar sensor for Radar toolkit;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

2. Analysis and Characterization of Castellated Holes as RF Interconnects for Modular Millimeter-Wave Devices;2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC);2023-09-11

3. Structural optimization of thermal stresses in BGA solder joints based on improved BP neural network-genetic algorithm;The European Physical Journal Plus;2023-08-14

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