Research on Signal Integrity of UWB BGA Differential Transmission Structure Based on HiTCE
Author:
Affiliation:
1. The 13th Research Institute, CETC,Shijiazhuang,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10022051/10022057/10023455.pdf?arnumber=10023455
Reference5 articles.
1. An Ultra-Wideband BGA-Via Transition for High-Speed Digital and Millimeter-Wave Packaging Applications
2. Overview of Signal Integrity Simulation for SFP+ Interface Serial Links with Advanced Design System (ADS)
3. A LTCC-BGA multi-chip packaging technology for MMICs up to Ku-band
4. Channel analysis of High Speed Digital Module and correlation between simulations and measurements
5. Signal integrity design and validation for multi-GHz differential channels in SiP packaging system with eye pattern parameters;gao;11th International Conference on Electronic Packaging Technology and High Density Packaging 2010,0
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