The Design of Leadless TTD TR Module with High Integration
Author:
Affiliation:
1. Nanjing Research Institute of Electronics Technology,Nanjing,China,210039
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10022051/10022057/10022577.pdf?arnumber=10022577
Reference8 articles.
1. Highly Integrated and Solderless LTCC Based C-Band T/R Module;roberto giordani;2009 European Microwave Integrated Circuits conference (EuMIC) EuMIC,2009
2. A Compact X-Band Bi-Directional Phased-Array T/R Chipset in 0.13 $\mu{\hbox {m}}$ CMOS Technology
3. High-Frequency Electrical Characterization of a New Coaxial Silicone Rubber Socket for High-Bandwidth and High-Density Package Test
4. High density packaging of X-band active array modules
5. A MEMS socket system foe high density SoC interconnection;chowdhury;2002 IEEE ISCAS,2002
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