Flip-Chip-Assembled $W$-Band CMOS Chip Modules on Ceramic Integrated Passive Device With Transition Compensation for Millimeter-Wave System-in-Package Integration-Reference-Cited by-同舟云学术

Flip-Chip-Assembled $W$-Band CMOS Chip Modules on Ceramic Integrated Passive Device With Transition Compensation for Millimeter-Wave System-in-Package Integration

Published:2012-03 Issue:3 Volume:60 Page:766-777
ISSN:0018-9480
Container-title:IEEE Transactions on Microwave Theory and Techniques
language:
Short-container-title:IEEE Trans. Microwave Theory Techn.

Author:

Lu Hsin-Chia,Kuo Che-Chung,Lin Po-An,Tai Chen-Fang,Chang Yi-Long,Jiang Yu-Sian,Tsai Jeng-Han,Hsin Yue-Ming,Wang Huei

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Radiation

Link

http://xplorestaging.ieee.org/ielx5/22/6158749/06129527.pdf?arnumber=6129527

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