Roles and Requirements of Electronic Packaging in 5G
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/8520538/8546331/08546469.pdf?arnumber=8546469
Cited by 11 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Flexible/Conformal Inkjet-Printed 3-D “Ramp” Interconnects for 5G/mmWave System-on-Package Designs and Wearable Applications;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-08
2. Electrical Demonstration of an RF Embedded Multichip Module Enabled by Fused-Silica Stitch-Chip Technology;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-07
3. Novel High Reliability and Low Dk/Df Dielectric RDL Material for High Frequency 5G Applications;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
4. Signal Integrity Analysis of IPD Decoupling Capacitor Structure;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07
5. A 2x2 Broadband Dual-Polarized Antenna Array using AiP Techniques for 5G mmWave Beamforming Systems;2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2022-10-26
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