Effect of New Types of PCB Surface Finishes on Fractographic Morphology of Solder Joints-Reference-Cited by-同舟云学术

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Effect of New Types of PCB Surface Finishes on Fractographic Morphology of Solder Joints

Published:2024-05-15 Issue: Volume: Page:1-4
ISSN:
Container-title:2024 47th International Spring Seminar on Electronics Technology (ISSE)
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Author:

Dzivy Daniel¹,Pietrikova Alena¹,Hornak Peter²

Affiliation:

1. Technical University of Kosice,Faculty of Electrical Engineering and Informatics,Dept. of Technologies in Electronics,Kosice,Slovakia

2. Metallurgy and Recycling Technical University of Kosice,Institute of Materials and Quality Engineering, Faculty of Materials,Kosice,Slovakia

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10603446/10603455/10603513.pdf?arnumber=10603513

Reference11 articles.

1. Fracture behavior and mechanical strength of sandwich structure solder joints with Cu–Ni(P) coating during thermal aging

2. Growth behavior of IMCs in Sn–1.0Ag–0.5Cu–xBi/Ni joints during isothermal aging

3. Effects of solder volume and size on microstructures and mechanical properties of Sn-3.0Ag-0.5Cu solder joints

4. Shear strength and fracture surface analysis of lead-free solder joints with high fraction of IMCs

5. Comparative study of interfacial reaction and bonding property of laser- and reflow-soldered Sn–Ag–Cu/Cu joints

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