Trends in electronic packaging and assembly for portable consumer products-Reference-Cited by-同舟云学术

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Trends in electronic packaging and assembly for portable consumer products

Published: Issue: Volume: Page:
ISSN:
Container-title:Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456)
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Author:

Beelen-Hendrikx C.,Verguld M.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/7262/19599/00906345.pdf?arnumber=906345

Cited by 14 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effects of Polyacrylonitrile Anchoring Polymer Layer Solder Anisotropic Conductive Films on the Solder Ball Movement for Fine-Pitch Flex-on-Flex (FOF) Assembly;IEEE Transactions on Components, Packaging and Manufacturing Technology;2019-05

2. Effects of Flux Activator Addition in Nanofiber/Solder Anisotropic Conductive Films (ACFs) on the Solder Wettability of Flex-on-Flex (FOF) Assembly;IEEE Transactions on Components, Packaging and Manufacturing Technology;2018-07

3. 82-4: Effects of the Anchoring Polymer Layer (APL) Materials on Conductive Particle Movements for Ultra-Fine Pitch Chip-on-Glass (COG) Interconnection;SID Symposium Digest of Technical Papers;2018-05

4. Nano-materials in Anisotropic Conductive Adhesives (ACAs);Nanopackaging;2018

5. Effect of Remelting Duration on Microstructure and Properties of SiCp/Al Composite Fabricated by Powder-Thixoforming for Electronic Packaging;Metals;2016-12-08

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