Die Attach Film Application in Multi Die Stack Package-Reference-Cited by-同舟云学术

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Die Attach Film Application in Multi Die Stack Package

Published: Issue: Volume: Page:
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Container-title:2005 7th Electronic Packaging Technology Conference
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Author:

Song S.N.,Tan H.H.,Ong P.L.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/10751/33892/01614517.pdf?arnumber=1614517

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Adhesive Fracture Analysis of Die Attach Film-Laminated Tape by 90° Peel Tests and Finite Element Analysis;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

2. Industrial Applications of THz Imaging Based on Resonant Slit-Type Probe;Journal of Electromagnetic Engineering and Science;2022-05-31

3. Transient Thermal Modeling of Die Bond Process in Multiple Die Stacked Flash Memory Package;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

4. Analysis of vapor pressure and void volume fraction evolution in porous polymers: A micromechanics approach;International Journal of Solids and Structures;2015-08

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