Author:
Nor Fethma M,Keat Loh Wei,Kamsah Nazri,Tamin Mohd Nasir
Cited by
1 articles.
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1. Effect of cooling rate and aging duration on microstructure of tin-copper solder joint;1ST INTERNATIONAL SEMINAR ON ADVANCES IN METALLURGY AND MATERIALS (i-SENAMM 2019);2020