1. Survey of Reliability Research on 3D Packaged Memory;Electronics;2023-06-17
2. Innovative reliability solution for WLCSP packages;2023 IEEE International Reliability Physics Symposium (IRPS);2023-03
3. State-Of-The-Art of Advanced Packaging;Chiplet Design and Heterogeneous Integration Packaging;2023
4. Advanced Chip Last Process Integration for Fan Out WLP;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05
5. Precise thixotropy controlled Bump Support Film for WLCSP;2021 IEEE CPMT Symposium Japan (ICSJ);2021-11-10