Development of coaxial shield via in silicon carrier for high frequency application-Reference-Cited by-同舟云学术

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Development of coaxial shield via in silicon carrier for high frequency application

Published:2006 Issue: Volume: Page:
ISSN:
Container-title:2006 8th Electronics Packaging Technology Conference
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Author:

Ho Soon,Rao Vempati,Navas Khan Oratti,Yoon Seung,Kripesh Vaidyanathan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/4147209/4141004/04147348.pdf?arnumber=4147348

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Design of the 28 GHz Antenna-In-Package (AIP) Using Glass Embedded IC Technology;2023 Asia-Pacific Microwave Conference (APMC);2023-12-05

2. Quasi-coaxial Through-Silicon via for Crosstalk Noise Suppression of 3D Integrated Microsystems;2023 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP);2023-11-13

3. Development and Prospect of Coaxial Through-Silicon Via in 3D Integrated Circuits;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

4. Electrical Characterization of Through-Silicon-via-Based Coaxial Line for High-Frequency 3D Integration (Invited Paper);Electronics;2022-10-21

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