Scalable multi-chip quantum architectures enabled by cryogenic hybrid wireless/quantum-coherent network-in-package-Reference-Cited by-同舟云学术

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Scalable multi-chip quantum architectures enabled by cryogenic hybrid wireless/quantum-coherent network-in-package

Published:2023-05-21 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE International Symposium on Circuits and Systems (ISCAS)
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Author:

Alarcón Eduard¹,Abadal Sergi¹,Sebastiano Fabio²,Babaie Masoud²,Charbon Edoardo³,Bolívar Peter Haring⁴,Palesi Maurizio⁵,Blokhina Elena⁶,Leipold Dirk⁶,Staszewski Bogdan⁷,Garcia-Sáez Artur⁸,Almudever Carmen G.⁹

Affiliation:

1. Technical University of Catalunya, BarcelonaTech,Spain

2. Delft University of Technology,The Netherlands

3. École polytechnique fé dérale de Lausanne,Switzerland

4. University of Siegen,Germany

5. University of Catania,Italy

6. Equal 1,Ireland

7. University College Dublin,Ireland

8. Barcelona Supercomputing Center,Spain

9. Technical University of Valencia,Spain

Funder

EU

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10181241/10181318/10181857.pdf?arnumber=10181857

Reference37 articles.

1. Large-scale modular quantum-computer architecture with atomic memory and photonic interconnects

2. Application-Motivated, Holistic Benchmarking of a Full Quantum Computing Stack

3. An elementary quantum network of single atoms in optical cavities

4. A volumetric framework for quantum computer benchmarks

5. Photon Enhanced Interaction and Entanglement in Semiconductor Position-Based Qubits

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Electromagnetic Nanonetworks Beyond 6G: From Wearable and Implantable Networks to On-Chip and Quantum Communication;IEEE Journal on Selected Areas in Communications;2024-08

2. A Dual-Signaling Architecture for Enhancing Noise Resilience in Floquet Engineering-Based Chip-Scale Wireless Communication;IEEE Journal on Selected Areas in Communications;2024-08

3. Collective Communication Patterns Using Time-Reversal Terahertz Links at the Chip Scale;GLOBECOM 2023 - 2023 IEEE Global Communications Conference;2023-12-04

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