TestDNA: Novel Wafer Defect Signature for Diagnosis and Pattern Recognition-Reference-Cited by-同舟云学术

TestDNA: Novel Wafer Defect Signature for Diagnosis and Pattern Recognition

Published:2020-08 Issue:3 Volume:33 Page:383-390
ISSN:0894-6507
Container-title:IEEE Transactions on Semiconductor Manufacturing
language:
Short-container-title:IEEE Trans. Semicond. Manufact.

Author:

Li Katherine Shu-Min^ORCID,Tsai Nova Cheng-Yen,Cheng Ken Chau-Cheung,Jiang Xu-Hao,Liao Peter Yi-Yu^ORCID,Wang Sying-Jyan^ORCID,Huang Andrew Yi-Ann,Chou Leon,Lee Chen-Shiun^ORCID

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/66/9158596/09089026.pdf?arnumber=9089026

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