Author:
van Driel W.D.,van Gils M.A.J.,Xuejun Fan ,Zhang G.Q.,Ernst L.J.
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Cited by
33 articles.
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1. Assessment of Delamination Risk During the Package Sawing Process by Simulation;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05
2. Delamination Improvement for High Voltage Power Devices;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05
3. Data-Driven Prediction of the Remaining useful Life of QFN Components Mounted on Printed Circuit Boards;2021 Smart Systems Integration (SSI);2021-04-27
4. Robust Package Study for A Power Package by Simulation;2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2021-04-19
5. Atmospheric pressure plasma reduction of copper oxide to copper metal;Journal of Vacuum Science & Technology A;2021-03