Characterization and modeling of a new via structure in multilayered printed circuit boards-Reference-Cited by-同舟云学术

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Characterization and modeling of a new via structure in multilayered printed circuit boards

Published:2003-06 Issue:2 Volume:26 Page:483-489
ISSN:1521-3331
Container-title:IEEE Transactions on Components and Packaging Technologies
language:en
Short-container-title:IEEE Trans. Comp. Packag. Technol.

Author:

DaeHan Kwon ,Jaewon Kim ,KiHyuk Kim ,SeungChul Choi ,JuHwan Lim ,Jung-Ho Park ,Lynn Choi ,SungWoo Hwang ,SeungHee Lee

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx5/6144/27385/01218246.pdf?arnumber=1218246

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Innovative Theory of Low-Pass NGD via-Hole-Ground Circuit;IEEE Access;2020

2. Modeling up to 45 GHz of coupling between microvias and PCB cavities considering several boundary conditions;International Journal of Microwave and Wireless Technologies;2016-02-19

3. Reflection Reduction on DDR3 High-Speed Bus by Improved PSO;The Scientific World Journal;2014

4. Minimization of Via-Induced Signal Reflection in On-Chip High Speed Interconnect Lines;Circuits, Systems, and Signal Processing;2011-07-30

5. Wideband Low-Reflection Transmission Lines for Bare Chip on Multilayer PCB;ETRI Journal;2011-06-07

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