Author:
Geun Woo Kim ,Kang Yong Lee
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Cited by
2 articles.
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1. Encapsulation defects and failures;Encapsulation Technologies for Electronic Applications;2019
2. Encapsulation Defects and Failures;Encapsulation Technologies for Electronic Applications;2009