Exothermic Reaction Induced Eutectic Pb–Sn Solder Ball Melting in the Underfill Curing Process
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Published:2004-03
Issue:1
Volume:27
Page:172-176
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ISSN:1521-3331
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Container-title:IEEE Transactions on Components and Packaging Technologies
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language:en
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Short-container-title:IEEE Trans. Comp. Packag. Technol.
Author:
Kwon W.-S.,Jang S.-Y.,Paik K.-W.
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials