Effects of the Functional Groups of Nonconductive Films (NCFs) on Material Properties and Reliability of NCF Flip-Chip-On-Organic Boards-Reference-Cited by-同舟云学术

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Effects of the Functional Groups of Nonconductive Films (NCFs) on Material Properties and Reliability of NCF Flip-Chip-On-Organic Boards

Published:2007-09 Issue:3 Volume:30 Page:464-471
ISSN:1521-3331
Container-title:IEEE Transactions on Components and Packaging Technologies
language:
Short-container-title:IEEE Trans. Comp. Packag. Technol.

Author:

Chung Chang-Kyu,Kwon Woon-Seong,Jang Kyung-Woon,Park Jin-Hyoung,Lee Soon-Bok,Paik Kyung-Wook

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx5/6144/4295144/04295149.pdf?arnumber=4295149

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Highly reliable anisotropic interconnection system fabricated using Cu/Sn-Soldered microdumbbell arrays and polyimide films for application to flexible electronics;Intermetallics;2022-05

2. The Effect of the Thermal Mechanical Properties of Nonconductive Films on the Thermal Cycle Reliability of 40- $\mu$ m Fine Pitch Cu-Pillar/Ni/SnAg Microbump Flip-Chip Assembly;IEEE Transactions on Components, Packaging and Manufacturing Technology;2019-01

3. The reliability of ultrasonic bonded Cu to Cu electrode for 3D TSV stacking;Journal of Materials Science: Materials in Electronics;2017-07-29

4. Warpage Behavior and Life Prediction of a Chip-on-Flex Package Under a Thermal Cycling Condition;IEEE Transactions on Components, Packaging and Manufacturing Technology;2014-07

5. Review paper: Flip chip bonding with anisotropic conductive film (ACF) and nonconductive adhesive (NCA);Current Applied Physics;2013-07

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