Author:
Sheng-Jye Hwang ,Yi-San Chang
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Cited by
19 articles.
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2. Warpage Optimization of Package Substrates Using Metamodels - A Review;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
3. Modeling the cure shrinkage–induced warpage of epoxy molding compound;International Journal of Mechanical Sciences;2024-04
4. 3-D modeling of automatic pressure gelation process for manufacturing gas insulated switchgear spacer using bio-based epoxy composite;Advanced Composite Materials;2023-11-23
5. Impact of Viscoelastic Properties on Package Warpage Prediction;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17