Author:
Xiao Huo ,Guo-Wei Xiao ,Chan P.C.H.,Chen K.J.
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Cited by
2 articles.
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1. Electronic Packaging: Solder Mounting Technologies;Reference Module in Materials Science and Materials Engineering;2016
2. Flip-Chip-Based Multichip Module for Low Phase-Noise $V$-Band Frequency Generation;IEEE Transactions on Microwave Theory and Techniques;2010-09