Critique of EIA SSB-1: guidelines for using plastic encapsulated microcircuits and semiconductors in military, aerospace, and other rugged applications
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Published:2002-06
Issue:2
Volume:25
Page:324-327
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ISSN:1521-3331
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Container-title:IEEE Transactions on Components and Packaging Technologies
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language:en
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Short-container-title:IEEE Trans. Comp. Packag. Technol.
Author:
O'Connor C.,McCluskey P.,Humphrey D.
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials