In-Situ Micro-Digital Image Speckle Correlation Technique for Characterization of Materials' Properties and Verification of Numerical Models-Reference-Cited by-同舟云学术

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In-Situ Micro-Digital Image Speckle Correlation Technique for Characterization of Materials' Properties and Verification of Numerical Models

Published:2004-12 Issue:4 Volume:27 Page:659-667
ISSN:1521-3331
Container-title:IEEE Transactions on Components and Packaging Technologies
language:en
Short-container-title:IEEE Trans. Comp. Packag. Technol.

Author:

Shi X.Q.,Pang H.L.J.,Zhang X.R.,Liu Q.J.,Ying M.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx5/6144/29862/01362799.pdf?arnumber=1362799

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3. Identifying the coefficients of thermal expansion of an electronic device composed of various materials using the virtual fields method;Measurement Science and Technology;2021-05-04

4. Measurement and comparison study of deformation using extensometer and 2D DIC technology;IOP Conference Series: Materials Science and Engineering;2020-02-01

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