Multiscale EMC Modeling, Simulation, and Validation of a Synchronous Step-Down DC-DC Converter
Author:
Affiliation:
1. Texas Instruments, Inc., Dallas, TX, USA
2. Texas Instruments, Inc., Santa Clara, CA, USA
3. Simyog Technology Private Limited, Bengaluru, India
4. Electrical Communication Engineering Department, Indian Institute of Science, Bangalore, India
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Management of Technology and Innovation
Link
http://xplorestaging.ieee.org/ielx7/7274859/10003074/10144433.pdf?arnumber=10144433
Reference40 articles.
1. Modeling of Conducted Emissions for EMI Analysis of Power Converters: State-of-the-Art Review
2. A tetrahedral modeling method for electromagnetic scattering by arbitrarily shaped inhomogeneous dielectric bodies
3. Model for Conducted Emission of SiC Power Modules for automotive traction Inverter-Comparison to behaviour-based Model
4. Electromagnetic scattering by surfaces of arbitrary shape
5. New modeling method based on transfer functions for EMI analysis in power electronic converters
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