Design Considerations for Cooling High Heat Flux IC Chips With Microchannels
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Software
Link
http://xplorestaging.ieee.org/ielx7/6221038/6873371/06710118.pdf?arnumber=6710118
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Investigation on the temperature distribution in the two-phase spider netted microchannel network heat sink with non-uniform heat flux;International Journal of Thermal Sciences;2021-11
2. Numerical study into the fin performance subjected to different periodic base temperatures employing Fourier and non-Fourier heat conduction models;International Communications in Heat and Mass Transfer;2020-05
3. Temperature uniformity in convective leaf vein-shaped fluid microchannels for phased array antenna cooling;International Journal of Thermal Sciences;2020-04
4. Review on Heat and Fluid Flow in Micro Pin Fin Heat Sinks under Single-phase and Two-phase Flow Conditions;Nanoscale and Microscale Thermophysical Engineering;2018-05-21
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