Bond Wire Lift-off Sensor Circuit for Power Devices Integrated in Gate Driver IC
Author:
Affiliation:
1. The University of Tokyo,Tokyo,Japan
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx8/10567049/10567050/10567703.pdf?arnumber=10567703
Reference16 articles.
1. Aging Diagnosis of Bond Wire Using On-State Drain-Source Voltage Separation for SiC MOSFET
2. Wear-Out Condition Monitoring of IGBT and mosfet Power Modules in Inverter Operation
3. Online Monitoring Bond Wires Fault of SiC MOSFETs With Kelvin Package Based on Turn-on Source Voltage Ringing
4. Bond Wire Damage Detection and SOH Estimation of a Dual-Pack IGBT Power Module Using Active Power Cycling and Reflectometry
5. Optimizing Sensor Count and Placement to Detect Bond Wire Lift-offs and Surface Defects in High-Power IGBT Modules using Low-Cost Piezo-electric Resonators
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