Multichip Integration on a PLC Platform for 16$\,\times\,$16 Optical Switch Module Using Passive Alignment Technique
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Published:2007-08
Issue:3
Volume:30
Page:457-461
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ISSN:1521-3323
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Container-title:IEEE Transactions on Advanced Packaging
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language:
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Short-container-title:IEEE Trans. Adv. Packag.
Author:
Rho Byung Sup,Lim Jung Woon
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Cited by
1 articles.
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