Electrical Characterization of Flip-Chip Interconnects Formed Using A Novel Conductive-Adhesive-Based Process
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Link
http://xplorestaging.ieee.org/ielx5/6040/34915/01667875.pdf?arnumber=1667875
Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Electromagnetic Nondestructive Material Characterization of Dielectrics Using EBG Based Planar Transmission Line Sensor;IEEE Sensors Journal;2016-10
2. A method enabling height-control of chips for edge-emitting laser stacking;Japanese Journal of Applied Physics;2015-03-27
3. Isotropic Conductive Adhesive Interconnect Technology in Electronics Packaging Applications;Adhesion in Microelectronics;2014-09-12
4. Conductive Adhesives;Wiley Encyclopedia of Electrical and Electronics Engineering;2013-09-19
5. Conductive Adhesives for Flip-Chip Applications;Advanced Flip Chip Packaging;2013
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