High-density 3-D packaging technology based on the sidewall interconnection method and its application for CCD micro-camera visual inspection system-Reference-Cited by-同舟云学术

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High-density 3-D packaging technology based on the sidewall interconnection method and its application for CCD micro-camera visual inspection system

Published:2003-05 Issue:2 Volume:26 Page:113-121
ISSN:1521-3323
Container-title:IEEE Transactions on Advanced Packaging
language:en
Short-container-title:IEEE Trans. Adv. Packag.

Author:

Yamada H.,Togasaki T.,Kimura M.,Sudo H.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/6040/27639/01233569.pdf?arnumber=1233569

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. 3-D Sidewall Interconnect Formation Climbing Over Self-Assembled KGDs for Large-Area Heterogeneous Integration;IEEE Transactions on Electron Devices;2017-07

2. An Algorithm of Determining the Plane Based on Monocular Vision and Laser Loop;Artificial Intelligence and Computational Intelligence;2011

3. Complete calibration of a structure-uniform stereovision sensor with free-position planar pattern;Sensors and Actuators A: Physical;2007-03

4. A Novel Approach to Calibrating Multifunctional Binocular Stereovision Sensor;Journal of Physics: Conference Series;2006-10-01

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