Author:
Wang Xing,Zhu Zhaohui,Cao Yi,Dvorak Steven L.,Prince John L.
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Cited by
1 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. A Reduced-Domain Layered-Medium Integral-Equation Method for Electronic Packages;2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS);2019-10