Improvement of Virtual Diagnostics Performance for Plasma Density in Semiconductor Etch Equipment Using Variational Auto-Encoder-Reference-Cited by-同舟云学术

Improvement of Virtual Diagnostics Performance for Plasma Density in Semiconductor Etch Equipment Using Variational Auto-Encoder

Published:2022-05 Issue:2 Volume:35 Page:256-265
ISSN:0894-6507
Container-title:IEEE Transactions on Semiconductor Manufacturing
language:
Short-container-title:IEEE Trans. Semicond. Manufact.

Author:

Kwon Ohyung¹^ORCID,Lee Nayeon²,Kim Kangil³^ORCID

Affiliation:

1. Functional Materials and Components Research and Development Group, Gangwon Division, Korea Institute of Industrial Technology, Gangneung, South Korea

2. Etch Equipment Development Group, SEMES, Cheonan, South Korea

3. School of Electrical Engineering and Computer Science, AI Graduate School, Gwangju Institute of Science and Technology, Gwangju, South Korea

Funder

National Research Foundation of Korea (NRF) Grant funded by the Korea Government [Ministry of Science and ICT (MSIT)]

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/66/9768876/09721398.pdf?arnumber=9721398

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