Chip-package codesign of a low-power 5-GHz RF front end-Reference-Cited by-同舟云学术

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Chip-package codesign of a low-power 5-GHz RF front end

Published:2000-10 Issue:10 Volume:88 Page:1583-1597
ISSN:0018-9219
Container-title:Proceedings of the IEEE
language:
Short-container-title:Proc. IEEE

Author:

Donnay S.,Pieters P.,Vaesen K.,Diels W.,Wambacq P.,De Raedt W.,Beyne E.,Engels M.,Bolsens I.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/5/19231/00888997.pdf?arnumber=888997

Cited by 40 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Micromachined high-performance RF passives in CMOS substrate;Journal of Micromechanics and Microengineering;2016-10-05

2. Tools for Chip-Package Co-Design;Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology;2016-04-14

3. A wafer-level multi-chip module process with thick photosensitive benzocyclobutene as the dielectric for microwave application;Journal of Micromechanics and Microengineering;2011-05-18

4. A micromachining technology for integrating low-loss GHz RF passives on non-high-resistivity low-cost silicon MCM substrate;Microelectronic Engineering;2010-11

5. High-Frequency Properties of Embedded Passives and Thermal Resistance in Organic Substrates for RF Module;International Journal of Microwave Science and Technology;2010-04-20

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