Author:
Bollmann D.,Braun R.,Buchner R.,Cao-Minh U.,Engelhardt M.,Errmann G.,Grassl T.,Hieber K.,Hubner H.,Kawala G.,Kleiner M.,Klumpp A.,Kuhn S.,Landesberger C.,Lezec H.,Muth W.,Pamler W.,Popp R.,Renner E.,Ruhl G.,Sanger A.,Scheler U.,Schmidt C.,Schwarzl S.,Weber J.,Weber W.,Ramm P.
Cited by
2 articles.
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1. Fundamentals of TSV and Recent Trend of 3D Integration & Packaging;Journal of The Japan Institute of Electronics Packaging;2022-11-01
2. Study on Cu Protrusion of Through-Silicon Via;IEEE Transactions on Components, Packaging and Manufacturing Technology;2013-05