Transient Leakage Current as a Non-destructive Probe of Wire-bond Electrochemical Failures
Author:
Affiliation:
1. Purdue University,West Lafayette,IN,USA,47907
2. NXP Semiconductors,Nijmegen,Netherlands
Funder
The Semiconductor Research Corporation, USA
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10117589/10117581/10117658.pdf?arnumber=10117658
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5. The How and why of Biased Humidity Tests with Copper Wire
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1. Electrically induced directional ion migration in two-dimensional perovskite heterostructures;Matter;2024-05
2. A Holistic Approach to Predict Wirebond Corrosion Failure in Extreme Operating Environments;2023 International Electron Devices Meeting (IEDM);2023-12-09
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