Advanced Methods of Detecting Physical Damages in Packaging and BEOL Interconnects
Author:
Affiliation:
1. University of Texas at Arlington,Materials Science and Engineering,Arlington,TX
2. Texas Instruments, Inc.,Dallas,Texas,75243
Funder
SRC (Semiconductor Research Corporation)
National Science Foundation
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10117589/10117581/10117720.pdf?arnumber=10117720
Reference6 articles.
1. Insulation Resistance of Dielectric Materials under Environmental Testing;mc brien;IPC APEX-EXPO Proceedings,2013
2. Defect inspection of flip chip solder bumps using an ultrasonic transducer;lei;SENSORS,2013
3. Spreading Resistance as a Function of Frequency
4. Analysis of voltage and current magnification in resonant circuits on hyperspectral signal processing
5. Microelectronic Failure Analysis. Desk Reference;ross;ASM International,1999
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1. Study of Damage Development in Under-Bump Interconnects by Thermo-Mechanical Stress in Package Interconnects;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
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