Production and Quality Assurance of Main Busbar Interconnection Splices During the LHC 2008

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Production and Quality Assurance of Main Busbar Interconnection Splices During the LHC 2008–2009 Shutdown

Published:2011-06 Issue:3 Volume:21 Page:1786-1790
ISSN:1051-8223
Container-title:IEEE Transactions on Applied Superconductivity
language:
Short-container-title:IEEE Trans. Appl. Supercond.

Author:

Bertinelli F.,Bottura L.,Dalin J.-M.,Fessia P.,Flora R. H.,Heck S.,Pfeffer H.,Prin H.,Scheuerlein C.,Thonet P.,Tock J.-P.,Williams L.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx5/77/5776774/05624607.pdf?arnumber=5624607

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Phased Array Ultrasonic Nondestructive Tests of Soldered Current-Carrying Bus-Bar Splices of Superconducting Magnets;IEEE Transactions on Applied Superconductivity;2018-06

2. Resistance of Splices in the LHC Main Superconducting Magnet Circuits at 1.9 K;IEEE Transactions on Applied Superconductivity;2018-04

3. Consolidation of the LHC Superconducting Magnets and Circuits;IEEE Transactions on Applied Superconductivity;2016-06

4. Consolidation of the 13-kA Superconducting Magnet Circuits of the LHC at CERN;IEEE Transactions on Applied Superconductivity;2015-06

5. Nondestructive Testing and Quality Control of the LHC Main Interconnection Splices;IEEE Transactions on Applied Superconductivity;2015-04

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