High Performances 3D Damascene MIM Capacitors Integrated in Copper Back-End Technologies-Reference-Cited by-同舟云学术

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High Performances 3D Damascene MIM Capacitors Integrated in Copper Back-End Technologies

Published:2006-10 Issue: Volume: Page:
ISSN:
Container-title:2006 Bipolar/BiCMOS Circuits and Technology Meeting
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Author:

Cremer S.,Richard C.,Benoit D.,Besset C.,Manceau J.-p.,Farcy A.,Perrot C.,Segura N.,Marin M.,Becu S.,Boret S.,Thomas M.,Guillaumet S.,Bonnard A.,Delpech P.,Bruyere S.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/4100194/4100195/04100236.pdf?arnumber=4100236

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Simulation and modelling of a high-performance trench capacitor for RF applications;Semiconductor Science and Technology;2009-06-02

2. A high-performance trench capacitor integrated in a passive integration technology;Semiconductor Science and Technology;2008-12-12

3. Wet Process Developments for Electrical Properties Improvement Of 3D MIM Capacitors;Solid State Phenomena;2007-11

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