Effect of Operational-Mode (PI/NPI) and Temperature (> 150°C) on Hysteresis Voltage in Low-Power MEMS Logic Relay

Author:

Kumar Sushil1,Arya Dhairya Singh1,Raghav Khusbu Singh2,Garg Manu1,Singh Pushpapraj1

Affiliation:

1. Centre for Applied Research in Electronics, Indian Institute of Technology,Delhi,India

2. Semiconductor Device Design Group, CEERI,Pilani,India

Publisher

IEEE

Reference15 articles.

1. Estimating the Surface Adhesion Force Using Pull-in/-out Hysteresis in Comb-Drive Devices

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3. Analytical compact model in verilog-a for electrostatically actuated ohmic switches;antonios;IEEE Trans on Elec Dev,2014

4. Characterizing Adhesion Limit Using Electromechanical Switches in Refractory Transition Metal (Mo) Contact Relay Operation at 300°C;kumar;IEEE Int Conf NANO 2021 (Accepted),0

5. Laser-assisted stress reduction in molybdenum microstructures for CMOS compatible MEMS integration;singh;Sensor and Actuator A Physical,2019

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