Intermittent Fault of Solder Joints: A Review-Reference-Cited by-同舟云学术

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Intermittent Fault of Solder Joints: A Review

Published:2022-12-15 Issue: Volume: Page:
ISSN:
Container-title:2022 4th International Conference on System Reliability and Safety Engineering (SRSE)
language:
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Author:

Liu Gen¹,Liu Shulin²,Wang Yueze³,Zhang Zijian⁴,Yi Xiaojian¹

Affiliation:

1. School of Mechatronical Engineering, Beijing Institute of Technology,Beijing,China,100081

2. China Institute of Marine Technology and Economy,Quality and Reliability Center,Beijing,China

3. Tianjin Navigation Instruments Research Institute,Tianjin,China

4. Tianjin Navigation Instruments Research Institute,Quality and Reliability Center,Tianjin,China

Funder

Equipment Development Department of the Central Military Commission of the People's Republic of China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10067247/10067267/10067378.pdf?arnumber=10067378

Reference42 articles.

1. A study of dynamic testing of single solder joints and its application to finite element modelling

2. Intelligent Built-in Test and Stress Measure[C];dale;IEEE International Automatic Testing Conference,1989

3. Research on Mechanism Analysis and Reproduction Technique of Cable Intermittent Fault under Vibration Stress (In English) [D];zhu;Journal of National University of Defense Technology,0

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