Data Acquisition and extraction on mobile devices-A Review-Reference-Cited by-同舟云学术

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Data Acquisition and extraction on mobile devices-A Review

Published:2022-06-07 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE International Workshop on Metrology for Industry 4.0 & IoT (MetroInd4.0&IoT)
language:
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Author:

Da Costa Alessandro Monteiro¹,De Sa Alan Oliveira²,Machado Raphael C. S.³

Affiliation:

1. Computer Science Institute, Fluminense Federal University (UFF),Niterói,Brasil

2. Universidade de Lisboa,LASIGE, Faculdade de Ciências,Lisboa,Portugal,1749-016

3. Inmetro and UFF,Rio de Janeiro,Brasil

Funder

CNPq

Faperj

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9831192/9831456/09831724.pdf?arnumber=9831724

Reference19 articles.

1. Electrically conductive adhesives, thermally conductive adhesives and UV adhesives in data extraction forensics

2. New acquisition method based on firmware update protocols for Android smartphones

3. A Platform with JTAG Debugging of SoC Based on System Level Verification

4. Methods to Acquire an Image from “Bricked” Android Device.

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Mobile Device Forensics, challenges and Blockchain-based Solution;2023 Second International Conference On Smart Technologies For Smart Nation (SmartTechCon);2023-08-18

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